food industry

Wafer cutting machine

mexbert gmbh - Waffelschneidmaschine für das automatisierte Schneiden von gestapelten Waffelblöcken in der Lebensmittelindustrie.

Machine introduction:

The “wafer cutting machine” is used for the automatic cutting of stacked wafer blocks.


Nominal output
10 cut cycles / minute

Technical details:

Base frame
welded construction made of stainless steel (1.4301)
wafers format
can be converted to different cut formats
Touch Panel
industrial enclosure integrated in the base frame
Control unit
Siemens S7-1500

Functional sequence:

  • Transfer and separate the wafer blocks
  • cut the blocks in two directions (maximum block height: 36 mm)
  • separate and discharge the edge section
  • reject the finished wafers

Wafer cutting system for bag filling:

The “wafer cutting machine” was designed as part of a system for processing wafer blocks. The system is completed by our “robot cell for wafer handling” and a conveyor belt system that transports the wafers to the filling line.

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